You will serve as the primary technical bridge between major North American chipmakers and overseas R&D teams. As the first local technical hire, you will lead design-in, qualification, and mass production activities for advanced IC substrate products. This role combines deep technical expertise in packaging with strategic customer-facing impact during a major market expansion.
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Application Engineer at Global semiconductor packaging manufacturer
Are you a bilingual packaging expert ready to lead a major market expansion? We are seeking an Application Engineer to be the first technical face in North America for a $2B global leader in IC substrates. You will bridge the gap between world-class R&D and the world's largest chipmakers, driving NPI and qualification for cutting-edge technologies like FC-BGA and chiplets. With a total compensation range of $200K-$350K and the autonomy to build a local presence from scratch, this is a rare opportunity to combine deep engineering with high-level strategic impact.
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Location
San Diego, United States
Compensation
$200k-$350k
Company
Confidential company
Role overview
About the company
Global semiconductor packaging manufacturer
What you will do
- Serve as the primary technical interface between North American customers and international engineering teams to drive product qualification.
- Analyze and resolve complex technical issues related to substrate design, materials, process yield, and reliability for mass production.
- Lead technical presentations and coordinate data exchange to ensure customer requirements for advanced packaging (FC-BGA, SiP) are met.
Who this is a fit for
- 5+ years of experience in IC packaging, substrates, or semiconductor assembly and test with a strong technical degree.
- Fully bilingual in English and Mandarin with the ability to lead deep technical discussions across diverse global stakeholders.
- Deep knowledge of advanced technologies like flip chip, chiplets, and 2.5D/3D packaging within an OSAT or foundry environment.
Why this role is remarkable
- Strategic autonomy as the first technical hire on the ground for a multi-billion dollar global industry leader.
- High visibility working directly with top-tier North American semiconductor firms on next-generation packaging technologies.
- Massive growth potential within a well-established company aggressively expanding its footprint in the advanced substrate market.
How Jack & Jill work together
I get to know what you’re great at, then find roles you’d never find yourself.Ok, I'll go first. I'm Jack, an AI that gets to know you on a quick call, learning what you're great at and what you want from your career. Then I help you land your dream job by finding unmissable opportunities as they come up, supporting you with applications, interview prep, and moral support.
I recruit from Jack’s network and make the intro when I spot a great match.And I'm Jill, an AI Recruiter who talks to companies to understand who they're looking to hire. Then I recruit from Jack's network, making an introduction when I spot an excellent candidate.
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If your profile’s a match and Confidential company wants to meet, Jill will make the intro. In the meantime, Jack will send you excellent alternatives.