As an Application Engineer, you will serve as the primary technical bridge between North American customers and international R&D teams. You will drive the success of advanced IC substrate products, including FC-BGA, by managing the entire lifecycle from design-in and qualification to mass production and technical issue resolution.
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Application Engineer at Global Semiconductor Component Manufacturer
Are you a semiconductor packaging expert looking for a high-impact technical role with exceptional compensation? This leading global manufacturer is seeking a bilingual Application Engineer to bridge the gap between North American tech giants and international R&D teams. You will drive the success of advanced IC substrate products like FC-BGA and chiplets, managing everything from design-in to mass production. If you have 5+ years of experience and speak Mandarin, this is a unique opportunity to shape the future of advanced packaging while earning up to $350k.
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Location
San Francisco, United States
Compensation
$200k-$350k
Company
Confidential company
Role overview
About the company
Global semiconductor component manufacturer
What you will do
- Lead technical discussions with customers regarding package requirements, substrate selection, and technical feasibility for advanced IC packaging.
- Coordinate seamlessly between North American commercial teams and overseas R&D units to ensure successful NPI and mass production.
- Analyze and resolve complex technical issues related to substrate design, materials, process yield, and product reliability.
Who this is a fit for
- 5+ years of experience in IC packaging, substrates, or semiconductor assembly and test with strong FC-BGA knowledge.
- Professional fluency in both English and Mandarin to facilitate deep technical communication across global cross-functional teams.
- Proven track record in a customer-facing engineering role with the ability to manage technical audits and design-in processes.
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Why this role is remarkable
- High-impact technical leadership role serving as the key interface for Tier-1 North American semiconductor customers.
- Opportunity to work at the forefront of advanced packaging technologies including 2.5D, 3D, and chiplet architectures.
- Significant autonomy in a customer-facing role with a highly competitive compensation package for technical experts.
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